Feature
1. Structured by metal and Aluminum , suitable for solder paste and red glue printing.
2. Manual work of location, board placement, printing, take board, etc.
3. Location mode: location by side or by hole, it has micromatic setting on four sides, used to solve the problem of position error between stencil and PCB.
4. Setting mode: manual, adjust as will.
5. It can be adjusted within 100mm, to comply with the thickness of PCB and location module.
Specification
Printing Area | Large 450 x 600mm |
Medium 310 x 410mm | |
Small 240 x 300mm | |
Location Mode | By side |
Setting Mode | Manual micromatic setting |
Setting Direction | Forward and backward, left and right, up and down |
Printing Precision | 0.5mm pitch QTP |